Mfr: Omron Electronics Inc-EMC Div
Series: XR2
Package: Bulk
Product Status: Active
Type: DIP, 0.6\ (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100\ (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0碌in (0.25碌m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100\ (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0碌in (0.25碌m)
