Mfr: TE Connectivity AMP Connectors
Series: -
Package: Tray
Product Status: Obsolete
Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 370 (19 x 19)
Pitch - Mating: 0.100\ (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0碌in (0.76碌m) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100\ (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0碌in (0.76碌m) Contact Material - Post: Copper Alloy Housing Material: Liquid Crystal Polymer (LCP)