Mfr: Adafruit Industries LLC
Series: -
Package: Bulk
Product Status: Active
Type: SOIC
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.050\ (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100.0碌in (2.54碌m) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.050\ (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100.0碌in (2.54碌m) Contact Material - Post: Copper Alloy Housing Material: Thermoplastic
