Mfr: Aries Electronics
Series: 516
Package: Bulk
Product Status: Active
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100\ (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0碌in (0.25碌m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100\ (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0碌in (0.25碌m) Contact Material - Post: Beryllium Copper Housing Material: Polyamide (PA46)
