Mfr: Omron Electronics Inc-EMC Div
Series: XR2
Package: Bulk
Product Status: Active
Type: DIP, 0.6\ (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100\ (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25.0碌in (0.63碌m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100\ (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 25.0碌in (0.63碌m)
