Mfr: Aries Electronics
Series: 547
Package: Bulk
Product Status: Active
Type: SOIC, ZIF (ZIP)
Number of Positions or Pins (Grid): 44 (2 x 22)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0碌in (0.51碌m)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050\ (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 20.0碌in (0.51碌m) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS) Glass Filled Operating Temperature: - Termination Post Length: 0.150\ (3.81mm) Material Flammability Rating: UL94 V-0 Current Rating (Amps): 1 A Contact Resistance: - Base Product Number: 44-547
