Mfr: Aries Electronics
Series: 518
Package: Bulk
Product Status: Active
Type: DIP, 0.6\ (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100\ (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0碌in (0.25碌m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100\ (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0碌in (5.08碌m)
