XR2C-2005 Omron Electronics Inc-EMC Div IC Sockets

Mfr: Omron Electronics Inc-EMC Div
Series: XR2
Package: Bulk
Product Status: Active
Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Pitch - Mating: 0.100\ (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0碌in (0.76碌m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100\ (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0碌in (0.76碌m) Contact Material - Post: Beryllium Copper Housing Material: Polybutylene Terephthalate (PBT)