TBL007A-500-21GY CUI Devices Wire to Board

Mfr: CUI Devices
Series: TBL007A-500
Package: Tray
Product Status: Active
Number of Levels: 1
Positions Per Level: 21
Pitch: 0.197\ (5.00mm)
Mating Orientation: 45掳 (135掳) Angle with Board
Current: 15 A
Voltage: 300 V
Wire Gauge: 14-26 AWG
Mounting Type: Through Hole
Wire Termination: Screwless - Spring Cage Tension Clamp
Features: Interlocking (Side)
Color: Gray
Operating Temperature: -40°C ~ 105°C
Housing Material: Polyamide (PA66) Nylon 6/6
Contact Material - Plating: Copper Alloy - Tin Plated
Clamp Material - Plating: -
Screw Material - Plating: -
Torque - Screw: -
Screw Thread: -
Base Product Number: TBL007A